Testing of materials for semiconductor technology ; contactless determination of the electrical resistivity of semiconductor slices with the eddy current method ; homogeneously doped semiconductor wafers 半導(dǎo)體工藝材料檢驗(yàn).用渦流法無(wú)接觸測(cè)定電阻率.均勻
Cubic boron nitride ( c - bn ) thin films have significant and potential technological application prospect in cutting tools , electronic and optical devices , etc . because c - bn possesses excellent physical and chemical properties , such as ultrahigh hardness only inferior to diamond , inertness against oxidation at high temperature , uneasy reaction with iron group metal , as well as the possibility of using as n - and p - type doped semiconductors 立方氮化硼( c - bn )具有優(yōu)異的物理化學(xué)性質(zhì),如僅次于金剛石的硬度、高溫下強(qiáng)的抗氧化能力、不易與鐵族金屬反應(yīng)、可n型摻雜也可p型摻雜成為半導(dǎo)體等,立方氮化硼( c - bn )薄膜在切削刀具、電子和光學(xué)器件等方面有著潛在的重要應(yīng)用前景。
Cubic boron nitride ( cbn ) thin films have significant and potential technological application prospect in cutting tools , electronic and optical devices , etc . , because cbn possesses excellent physical and chemical properties , such as ultrahigh hardness only inferior to diamond , inertness against oxidation at high temperature , uneasy reaction with iron group metal , as well as the possibility of using as n - and p - type doped semiconductors 立方氮化硼( cbn )具有優(yōu)異的物理化學(xué)性質(zhì),如僅次于金剛石的硬度、高溫下強(qiáng)的抗氧化能力、不易與鐵族金屬反應(yīng)、可n型摻雜也可p型摻雜成為半導(dǎo)體等,立方氮化硼( cbn )薄膜在切削刀具、電子和光學(xué)器件等方面有著潛在的重要應(yīng)用前景。